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Comparative Analysis of Mechanical Properties of Banana Peel-Based Biocomposites Through ASTM Standardized Mechanical Testing

  • Javier Chavez
  • , Rodrigo Vargas MacHuca
  • , Jose Carrizales
  • , Jose Becerra
  • , Julio Ronceros
  • , Nain Ramos
  • Universidad Peruana de Ciencias Aplicadas
  • obtuvo un doctorado en la de Maryland y realizó un postdoctorado de la Universidad de Toronto. Es docente-investigador en la Universidad San Ignacio de Loyola

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This study develops biocomposites from pulverized banana peel, gelling agent (gelatin), glycerin, and glacial acetic acid as a sustainable alternative to petroleum-derived synthetic textile materials. A controlled experimental design was imple-mented to evaluate the effect of varying glycerin concentrations (+20% and +40%) and different gelatin-to-water ratios (30/70%, 40/60 %) on the mechanical properties of the material. The samples were molded into Type IV specimens according to ASTM D638 and subjected to tensile testing using a universal testing machine (UTM). Experimental results revealed that the formulation with an additional 20 % glycerin, a 30 % gelatin to 70 % water ratio, and reinforcement with pulverized banana achieved optimized mechanical properties: Young's modulus of 7.84 Nzmm', maximum tensile stress of 2.22 Nzmm-, and elongation at break of 28.35 %. Validation through finite element simulation in ANSYS Mechanical showed acceptable correlation with experimental data, with experimental stresses of 2.22 MPa compared to 2.43 MPa in the simulation.

Original languageEnglish
Title of host publicationProceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025
EditorsGianpierre Zapata Ramirez, Carlos Raymundo Ibanez, Heyul Chavez Arias
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331599928
DOIs
StatePublished - 2025
Event32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025 - Arequipa, Peru
Duration: 20 Aug 202522 Aug 2025

Publication series

NameProceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025

Conference

Conference32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025
Country/TerritoryPeru
CityArequipa
Period20/08/2522/08/25

Keywords

  • ANSYS Mechanical
  • ASTM D638
  • Biocomposites
  • banana peel
  • mechanical strength
  • textile

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