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Design and Internal Flow Study Using CFD of an Elliptic Vortex Gripper with Variable Geometry for Polyethylene Bag Packaging

  • Italo I. Luque
  • , Elihasid B. Echia
  • , Julio Ronceros
  • , Ayrton Nieves
  • , Jose Carrizales
  • , Luis A. Sampen
  • Universidad Peruana de Ciencias Aplicadas

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This work presents a study of the internal flow in various elliptic vortex grippers designed to generate an air vortex, applying the operating principle of conventional vortex grippers but adapted to non-circular shapes. The study and design focus on a specific application in the counting and packaging process of folded polyethylene bags, with the aim of improving production efficiency without compromising the integrity of the packages or the bags and reducing count errors. Initially, a simplified vortex flow model proposed by a previous author is used to determine the basic circular geometry of the nozzle. Computational fluid dynamics (CFD) simulations are then employed to investigate how the pressure distribution changes in the elliptic nozzles, which maintain the same area as the initial circular nozzle. This is done by varying the ratio between the major and minor diameters, and adjusting the position of the air inlet, to identify the most efficient configuration in terms of achieving the lowest pressure and optimizing the pressure drop distribution along the major axis. The results guide the design towards an efficient and adaptable solution tailored to the specific requirements of vacuum gripping applications.

Original languageEnglish
Title of host publicationProceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025
EditorsGianpierre Zapata Ramirez, Carlos Raymundo Ibanez, Heyul Chavez Arias
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331599928
DOIs
StatePublished - 2025
Event32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025 - Arequipa, Peru
Duration: 20 Aug 202522 Aug 2025

Publication series

NameProceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025

Conference

Conference32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025
Country/TerritoryPeru
CityArequipa
Period20/08/2522/08/25

Keywords

  • Automated packaging
  • Internal flow CFD
  • Non-circular nozzles
  • Vacuum gripping
  • Vortex gripper

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