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Improving On-Time Delivery for a Footwear Company through SLP, 5S Methodology, and Anthropometry

  • Javier Isaac Urtecho Jimenez
  • , Daniela Mac Huca Vasquez
  • , José C. Alvarez
  • , Robert Lepore
  • Universidad Peruana de Ciencias Aplicadas
  • University of Arizona

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The footwear industry is confronted with the challenge of a high percentage of delivery delays, resulting in economic penalties and decreased customer satisfaction. In this context, this research proposes a solution that includes the application of Systematic Layout Planning (SLP) and the 5S methodology with an ergonomic approach based on anthropometry, as musculoskeletal disorders also contribute to production delays due to worker absenteeism or fatigue. Various studies have applied the 5S methodology in conjunction with SLP. However, none of them have taken this important ergonomic approach into account, which is crucial for maintaining a healthy work environment. The objective of this proposal is to improve the production process by eliminating unnecessary activities, reducing transportation times, and optimizing workstation design. As a result of the implementation, a significant increase in the on-time delivery rate was achieved, reaching 90%. Through the analysis, it was concluded that the application of these methods with an ergonomic focus has created synergy and enabled improvements in the production process by considering good working conditions for employees and the prevention of musculoskeletal disorders (MSDs).

Original languageEnglish
Title of host publicationProceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025
EditorsGianpierre Zapata Ramirez, Carlos Raymundo Ibanez, Heyul Chavez Arias
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331599928
DOIs
StatePublished - 2025
Event32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025 - Arequipa, Peru
Duration: 20 Aug 202522 Aug 2025

Publication series

NameProceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025

Conference

Conference32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025
Country/TerritoryPeru
CityArequipa
Period20/08/2522/08/25

Keywords

  • Ergonomics
  • Footwear
  • Lean
  • MSDs
  • SLP

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