A framework for non-functional testing process of mobile applications

Fernando L. Arteaga, Fiorela R. Contreras, Alfredo Barrientos

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

1 Cita (Scopus)

Resumen

Currently, there is a considerable growth in the acquisition of mobile devices with different characteristics, sizes or operating system versions, they allow the execution of different mobile applications, under this premise it is very important to emphasize the phases of the mobile application testing process.Therefore, this study proposes a framework for the process of non-functional testing process where the non-functional requirements that should be considered for mobile application tests, test case scenarios (TCS) and tools to test and execute these TCS. In addition, a cost-benefit analysis will be presented, according to the types of test execution; considering cloud and local tools.In order to validate our framework, we conducted surveys to experts in the field and the framework was applied to a mobile application. In this way, with the proposed framework, according to the validation, the complexity of the non-functional testing process is reduced and it is possible to identify the largest number of errors of a mobile application, prior to deployment in production.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9781728136462
DOI
EstadoPublicada - ago. 2019
Evento26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019 - Lima, Perú
Duración: 12 ago. 201914 ago. 2019

Serie de la publicación

NombreProceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019

Conferencia

Conferencia26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
País/TerritorioPerú
CiudadLima
Período12/08/1914/08/19

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