TY - GEN
T1 - Assessment System for Physical Abuse in adolescents caused by Domestic Violence
AU - Caytuiro, Yesenia Cruzado
AU - Navarro Mantari, Kerling A.
AU - Durango, Daniel Wilfredo Burga
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Research shows that around 300 million children in the world live in situations of violence in their homes. In addition, it is mentioned that the attention to these cases is not adequate in terms of attention time and treatment [1]. This paper presents a web application which obtains statistics in real time that allows specialists to show cases of physical abuse and thus be able to intervene quickly. We present a system based on Amazon Web Services (AWS) made with MySql database and the RDS service. Compared to the traditional method, a survey carried out on paper and with a data processing time. This comparison showed that the average data capture rate is lower than with the traditional method since the data is uploaded to the network instantly without the need to digitize the responses and it can also be used anywhere with internet access.
AB - Research shows that around 300 million children in the world live in situations of violence in their homes. In addition, it is mentioned that the attention to these cases is not adequate in terms of attention time and treatment [1]. This paper presents a web application which obtains statistics in real time that allows specialists to show cases of physical abuse and thus be able to intervene quickly. We present a system based on Amazon Web Services (AWS) made with MySql database and the RDS service. Compared to the traditional method, a survey carried out on paper and with a data processing time. This comparison showed that the average data capture rate is lower than with the traditional method since the data is uploaded to the network instantly without the need to digitize the responses and it can also be used anywhere with internet access.
KW - analysis of data
KW - data processing
KW - physical abuse
KW - screening tool
UR - https://www.scopus.com/pages/publications/85138772664
U2 - 10.1109/INTERCON55795.2022.9870055
DO - 10.1109/INTERCON55795.2022.9870055
M3 - Contribución a la conferencia
AN - SCOPUS:85138772664
T3 - Proceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
BT - Proceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
Y2 - 11 August 2022 through 13 August 2022
ER -