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Comparative Analysis of Mechanical Properties of Banana Peel-Based Biocomposites Through ASTM Standardized Mechanical Testing

  • Javier Chavez
  • , Rodrigo Vargas MacHuca
  • , Jose Carrizales
  • , Jose Becerra
  • , Julio Ronceros
  • , Nain Ramos
  • Universidad Peruana de Ciencias Aplicadas
  • obtuvo un doctorado en la de Maryland y realizó un postdoctorado de la Universidad de Toronto. Es docente-investigador en la Universidad San Ignacio de Loyola

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

This study develops biocomposites from pulverized banana peel, gelling agent (gelatin), glycerin, and glacial acetic acid as a sustainable alternative to petroleum-derived synthetic textile materials. A controlled experimental design was imple-mented to evaluate the effect of varying glycerin concentrations (+20% and +40%) and different gelatin-to-water ratios (30/70%, 40/60 %) on the mechanical properties of the material. The samples were molded into Type IV specimens according to ASTM D638 and subjected to tensile testing using a universal testing machine (UTM). Experimental results revealed that the formulation with an additional 20 % glycerin, a 30 % gelatin to 70 % water ratio, and reinforcement with pulverized banana achieved optimized mechanical properties: Young's modulus of 7.84 Nzmm', maximum tensile stress of 2.22 Nzmm-, and elongation at break of 28.35 %. Validation through finite element simulation in ANSYS Mechanical showed acceptable correlation with experimental data, with experimental stresses of 2.22 MPa compared to 2.43 MPa in the simulation.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025
EditoresGianpierre Zapata Ramirez, Carlos Raymundo Ibanez, Heyul Chavez Arias
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798331599928
DOI
EstadoPublicada - 2025
Evento32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025 - Arequipa, Perú
Duración: 20 ago. 202522 ago. 2025

Serie de la publicación

NombreProceedings of the 2025 IEEE 32nd International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025

Conferencia

Conferencia32nd IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2025
País/TerritorioPerú
CiudadArequipa
Período20/08/2522/08/25

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