Design of a multi-hole cylindrical extruder, driven by a linear actuator and used for the formation of bakery dough

Cesar Padilla, Aida Vivanco, Leonardo Vinces, Mirko Klusmann

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

15 Citas (Scopus)

Resumen

The present work proposes a solution for the conditioning of bakery dough with the purpose of reducing costs by replacing manual work with a mechanized system that will be a piston extruder. In the process, the mass will be contained within a 304 stainless steel prismatic matrix with multiple outlet openings for optimization of the production line. The mechanical properties of bread dough were studied for the design of the platform and the estimation of the necessary compression force. A linear actuator was used, which exerts a compression force of 6 kN, which maximum linear speed is 5 mm/s. Validation of results will be carried out through simulated tests with a density mass of 1452.9 kg/m3. The system is composed of a linear actuator that performs the function of an extruder, followed by a pneumatic wire cutter. The process continues with a conveyor belt and ends with the injection of sesame seeds.The fundamental contribution is in the design of the extrusion chamber, since it allows the flow of the mass leaving minimal residue.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9781728193779
DOI
EstadoPublicada - set. 2020
Evento27th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020 - Virtual, Lima, Perú
Duración: 3 set. 20205 set. 2020

Serie de la publicación

NombreProceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020

Conferencia

Conferencia27th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020
País/TerritorioPerú
CiudadVirtual, Lima
Período3/09/205/09/20

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