Maturity model for data leakage security protocols in telecommunications companies applying the NIST framework

Solis Leon, Brian Joel, Di Paola Jara, Renzo Giovanni, Copaja Cornejo, Richard Nivaldo

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

Attacks on information security and data leaks in telecommunications companies in Peru cause considerable losses both financially and in terms of social reputation. For this reason, response protocols have been implemented to deal with these situations. However, the mere implementation and development of these protocols is not enough to effectively prevent or counter attacks. Therefore, a technological solution is proposed that combines a maturity assessment model for protocols and a reporting system that provides information on the current level and possible improvements that can be applied to the assessed protocols. The project aims to reduce attacks on companies in the telecommunications sector and at the same time enable them to assess the state of their protocols in terms of cybersecurity, giving them greater insight into possible situations that could result from protocol misuse. To validate the project, 4 cybersecurity experts were involved, who have used it for a given period to obtain sufficient information to offer their opinion. At the end of the period of use, a form was sent to them to evaluate the level of satisfaction with the project, using the indicators that were established. The final level of satisfaction obtained was 81.39%, which indicates that the project has been successful according to the evaluation of the security experts.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798350315578
DOI
EstadoPublicada - 2023
Evento30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023 - Lima, Perú
Duración: 2 nov. 20234 nov. 2023

Serie de la publicación

NombreProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023

Conferencia

Conferencia30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
País/TerritorioPerú
CiudadLima
Período2/11/234/11/23

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