Mobile application for interactive learning of human anatomy using augmented reality

Juan Carlos Hernandez Castillo, Gino Salvador Quispe Calixto, Alvaro Antonio Aures Garcia, Daniel Alejandro Subauste Oliden

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

1 Cita (Scopus)

Resumen

In the last decade, the push for digitalization due to the recent pandemic has led to the constant evolution of different fields. However, in the field of anatomy education, students' learning resources remain the same as they have been used in recent years, as does the lack of technological skills among educators in Peru. With the aim of providing a new alternative for learning human anatomy to the general public and promoting technology, the project aims to design, implement and validate a mobile application solution using augmented reality. This innovative approach helps to address a potential impact on the quality of education in the country. Our research demonstrates the feasibility and benefits of integrating AR into anatomy education such as improved enthusiasm for learning and retention of information versus traditional methods. All of this is reflected in the enhancement of comprehension and educational outcomes.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798350315578
DOI
EstadoPublicada - 2023
Publicado de forma externa
Evento30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023 - Lima, Perú
Duración: 2 nov. 20234 nov. 2023

Serie de la publicación

NombreProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023

Conferencia

Conferencia30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
País/TerritorioPerú
CiudadLima
Período2/11/234/11/23

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