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SMED 4.0 and TPM Integration for OEE Improvement in Label Printing: A Simulation-Based Validation Study

  • Universidad Peruana de Ciencias Aplicadas
  • University of Colombia

Producción científica: Contribución a una revista › Artículo de la conferencia › revisión exhaustiva

Resumen

The printing industry faces efficiency challenges due to long setup times, unplanned downtime, and a lack of standardized parameters, resulting in low Overall Equipment Effectiveness (OEE). This study proposes an integrated improvement model that combines the pillars of Total Productive Maintenance (TPM) - specifically autonomous and planned maintenance - with the Single-Minute Exchange of Die (SMED) methodology and Industry 4.0 tools (IoT sensors, OPC-UA protocol, and predictive analytics), applied to a label printing company. The model was evaluated through discrete-event simulation using Rockwell Arena software. The simulation results show a 45% reduction in setup times, a 30% decrease in unplanned downtime, and an OEE improvement from 66.85% to 82% (16 percentage points), with a projected return on investment (ROI) within eight months. The proposed framework provides a replicable approach for small and medium-sized enterprises (SMEs) in the graphic sector, enabling improved machine availability and competitiveness through Lean-Industry 4.0 integration.

Idioma originalInglés
Páginas (desde-hasta)315-319
Número de páginas5
PublicaciónProceedings of the International Conference on Mechanical and Intelligent Manufacturing Technologies, ICMIMT
N.º2026
DOI
EstadoPublicada - 2026
Evento17th International Conference on Mechanical and Intelligent Manufacturing Technologies, ICMIMT 2026 - Cape Town, Sudáfrica
Duración: 13 may. 2026 → 15 may. 2026

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