Telepresence Technological Model Applied to Primary Education

David Yovera Chavez; Gonzalo Villena Romero; Alfredo Barrientos Villalta; Miguel Cuadros Galvez

doi:10.1109/INTERCON50315.2020.9220209

Telepresence Technological Model Applied to Primary Education

David Yovera Chavez, Gonzalo Villena Romero, Alfredo Barrientos Villalta, Miguel Cuadros Galvez

Facultad de Ingeniería

Universidad Peruana de Ciencias Aplicadas

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

1 Cita (Scopus)

Resumen

This research paper proposes a low-cost telepresence technological model focused on primary education. Its aim is to give students a new resource/communication channel for classes, which would be used when they cannot attend school due to health problems that do not affect their learning process. This solution seeks students to not be passive listeners during a session, but that they interact with their classmates and teachers during class. To validate the model, a telepresence platform based on WebRTC was developed. It was tested in three schools in different geographical areas belonging to socioeconomic sector C, collecting data from the students who tested the tool, as well as from classmates, teachers, and parents.

Idioma original	Inglés
Título de la publicación alojada	Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020
Editorial	Institute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)	9781728193779
DOI	https://doi.org/10.1109/INTERCON50315.2020.9220209
Estado	Publicada - set. 2020
Evento	27th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020 - Virtual, Lima, Perú Duración: 3 set. 2020 → 5 set. 2020

Serie de la publicación

Nombre	Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020

Conferencia

Conferencia	27th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020
País/Territorio	Perú
Ciudad	Virtual, Lima
Período	3/09/20 → 5/09/20

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10.1109/INTERCON50315.2020.9220209

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Yovera Chavez, D., Villena Romero, G., Barrientos Villalta, A., & Cuadros Galvez, M. (2020). Telepresence Technological Model Applied to Primary Education. En Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020 Artículo 9220209 (Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INTERCON50315.2020.9220209

Yovera Chavez, David ; Villena Romero, Gonzalo ; Barrientos Villalta, Alfredo et al. / Telepresence Technological Model Applied to Primary Education. Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020. Institute of Electrical and Electronics Engineers Inc., 2020. (Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020).

@inproceedings{362f4b67e1f3483080a9f3b19fbecaf5,

title = "Telepresence Technological Model Applied to Primary Education",

abstract = "This research paper proposes a low-cost telepresence technological model focused on primary education. Its aim is to give students a new resource/communication channel for classes, which would be used when they cannot attend school due to health problems that do not affect their learning process. This solution seeks students to not be passive listeners during a session, but that they interact with their classmates and teachers during class. To validate the model, a telepresence platform based on WebRTC was developed. It was tested in three schools in different geographical areas belonging to socioeconomic sector C, collecting data from the students who tested the tool, as well as from classmates, teachers, and parents.",

keywords = "WebRTC, technological model, telepresence",

author = "\{Yovera Chavez\}, David and \{Villena Romero\}, Gonzalo and \{Barrientos Villalta\}, Alfredo and \{Cuadros Galvez\}, Miguel",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 27th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020 ; Conference date: 03-09-2020 Through 05-09-2020",

year = "2020",

month = sep,

doi = "10.1109/INTERCON50315.2020.9220209",

language = "Ingl{\'e}s",

series = "Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020",

}

Yovera Chavez, D, Villena Romero, G, Barrientos Villalta, A & Cuadros Galvez, M 2020, Telepresence Technological Model Applied to Primary Education. En Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020., 9220209, Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020, Institute of Electrical and Electronics Engineers Inc., 27th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020, Virtual, Lima, Perú, 3/09/20. https://doi.org/10.1109/INTERCON50315.2020.9220209

Telepresence Technological Model Applied to Primary Education. / Yovera Chavez, David; Villena Romero, Gonzalo; Barrientos Villalta, Alfredo et al.
Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9220209 (Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020).

Producción científica: Capítulo del libro/informe/acta de congreso › Contribución a la conferencia › revisión exhaustiva

TY - GEN

T1 - Telepresence Technological Model Applied to Primary Education

AU - Yovera Chavez, David

AU - Villena Romero, Gonzalo

AU - Barrientos Villalta, Alfredo

AU - Cuadros Galvez, Miguel

PY - 2020/9

Y1 - 2020/9

N2 - This research paper proposes a low-cost telepresence technological model focused on primary education. Its aim is to give students a new resource/communication channel for classes, which would be used when they cannot attend school due to health problems that do not affect their learning process. This solution seeks students to not be passive listeners during a session, but that they interact with their classmates and teachers during class. To validate the model, a telepresence platform based on WebRTC was developed. It was tested in three schools in different geographical areas belonging to socioeconomic sector C, collecting data from the students who tested the tool, as well as from classmates, teachers, and parents.

AB - This research paper proposes a low-cost telepresence technological model focused on primary education. Its aim is to give students a new resource/communication channel for classes, which would be used when they cannot attend school due to health problems that do not affect their learning process. This solution seeks students to not be passive listeners during a session, but that they interact with their classmates and teachers during class. To validate the model, a telepresence platform based on WebRTC was developed. It was tested in three schools in different geographical areas belonging to socioeconomic sector C, collecting data from the students who tested the tool, as well as from classmates, teachers, and parents.

KW - WebRTC

KW - technological model

KW - telepresence

UR - https://www.scopus.com/pages/publications/85095418333

U2 - 10.1109/INTERCON50315.2020.9220209

DO - 10.1109/INTERCON50315.2020.9220209

M3 - Contribución a la conferencia

AN - SCOPUS:85095418333

T3 - Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020

BT - Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 27th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020

Y2 - 3 September 2020 through 5 September 2020

ER -

Yovera Chavez D, Villena Romero G, Barrientos Villalta A, Cuadros Galvez M. Telepresence Technological Model Applied to Primary Education. En Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9220209. (Proceedings of the 2020 IEEE 27th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2020). doi: 10.1109/INTERCON50315.2020.9220209

Telepresence Technological Model Applied to Primary Education

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